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SP900S-0.009-AC-54

Name: Bergquist Company SP900S-0.009-AC-54
Brand: Bergquist Company
SKU: 951-SP900S-009-AC-54
Price: 75.53 INR
Availability: InStock

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Mouser No:

951-SP900S-009-AC-54

Mfr. No:

SP900S-0.009-AC-54

Description:

Thermal Interface Products Sil-Pad, Low-Pressure, 0.009" Thickness, 1 Side Adhesive, 19.05x12.7mm

Datasheet:

SP900S-0.009-AC-54 Datasheet (PDF)

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In Stock: 59,381

Stock:: 59,381 Can Dispatch Immediately

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Factory Lead Time:: 12 Weeks Estimated factory production time for quantities greater than shown.

Minimum: 1 Multiples: 1

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹75.53	₹75.53
	₹67.23	₹672.30
	₹60.26	₹3,013.00
	₹53.37	₹5,337.00
	₹46.40	₹23,200.00
	₹34.78	₹34,780.00
	₹30.13	₹1,50,650.00

Specifications

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:	Details
Product:	Thermally Conductive Insulator
Type:	Thermal Pad
Material:	Silicone Elastomer
Thermal Conductivity:	1.6 W/m-K
Breakdown Voltage:	5.5 kVAC
Color:	Pink
Minimum Operating Temperature:	- 60 C
Maximum Operating Temperature:	+ 180 C
Length:	19.05 mm
Width:	12.7 mm
Thickness:	0.229 mm
Tensile Strength:	9 MPa
Flammability Rating:	UL 94 V-0
Series:	900S / TSP 1600S
Brand:	Bergquist Company
Product Type:	Thermal Interface Products
Factory Pack Quantity:	100
Subcategory:	Thermal Management
Tradename:	Sil-Pad
Part # Aliases:	BG401580 2188963
Unit Weight:	474.440 mg

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Attributes selected: 0

Product Comments

                    
Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

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Product Compliance

CNHTS:: 3824999999
USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

Bergquist Company Thermal SIL PAD^® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD^® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.

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