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SEN0299

Name: DFRobot SEN0299
Brand: DFRobot
SKU: 426-SEN0299
Price: 1015.66 INR
Availability: OutOfStock

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Mouser No:

426-SEN0299

Mfr. No:

SEN0299

Mfr.:

DFRobot

Description:

Pressure Sensor Development Tools RP-L-400 Thin Film Pressure Sensor

More Information

Learn more about DFRobot SEN0299

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This item may require additional fees and documentation. Customs delays may also occur.

Availability

Stock:: 0

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On Order:: 22

Expected 02-06-2026

22

Expected 22-06-2026
Factory Lead Time:: 8

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹1,015.66	₹1,015.66

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	DFRobot
Product Category:	Pressure Sensor Development Tools
Delivery Restrictions:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Product:	Evaluation Modules
Type:	Pressure Sensor
Tool Is For Evaluation Of:	RP-L-400
Brand:	DFRobot
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 40 C
Product Type:	Pressure Sensor Development Tools
Factory Pack Quantity:	1
Subcategory:	Development Tools
Unit Weight:	51.194 g

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RoHS Certificate (PDF)

Compliance Codes

USHTS:: 9031808085
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

RP Series Thin Film Pressure Sensors

DFRobot RP Series Thin Film Pressure Sensors are made of ultra-thin film with excellent mechanical properties, conductive materials, and nanometer pressure-sensitive layers. These durable sensors are designed to sense static and dynamic pressure at high response speed. The RP sensors come with a thin film and pressure-sensitive layer on the upper layer and a thin film and conductive circuit on the lower layer. These layers in the sensors are glued together with double-sided tape. The RP sensors convert pressure into resistance by connecting the disconnected circuit of the lower layer through a pressure-sensitive layer of the upper layer.