1008F-100J-01

Fastron
434-1008F-100J-01
1008F-100J-01

Mfr.:

Description:
RF Inductors - SMD Chip Inductor (Wire wound -open); 10H; Tol: 5%

Datasheet:
ECAD Model:
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Learn more about Fastron 1008F-100J-01

Availability

Stock:
Non-Stocked
Factory Lead Time:
6 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (INR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
₹36.34 ₹36.34
₹31.03 ₹310.30
₹28.51 ₹712.75
₹23.02 ₹2,302.00
₹21.71 ₹5,427.50
₹18.64 ₹9,320.00
₹18.08 ₹18,080.00
Full Reel (Order in multiples of 2000)
₹15.28 ₹30,560.00
† A MouseReel™ fee of ₹475.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
10 uH
5 %
AEC-Q200
1008F
Reel
Cut Tape
MouseReel
Brand: Fastron
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Products found:
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Attributes selected: 0

Datasheet

Application Notes

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Compliance Codes
CNHTS:
8504500000
USHTS:
8504508000
TARIC:
8504509590
ECCN:
EAR99
Origin Classifications
Country of Origin:
Malaysia
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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