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C0805X104M5RACTU

Name: KEMET C0805X104M5RACTU
Brand: KEMET
SKU: 80-C0805X104M5RACTU
Price: 36.52 INR
Availability: InStock

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Mouser No:

80-C0805X104M5RACTU

Mfr. No:

C0805X104M5RACTU

Mfr.:

KEMET

Description:

Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 0.1uF X7R 0805 20% Flex Soft

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Datasheet:

C0805X104M5RACTU Datasheet (PDF)

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In Stock: 11,849

Stock:: 11,849 Can Dispatch Immediately

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Factory Lead Time:: 18 Weeks Estimated factory production time for quantities greater than shown.

Minimum: 1 Multiples: 1

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Ext. Price:

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Packaging:

Full Reel (Order in multiples of 4000)

Cut Tape

MouseReel™ (+₹475.00)

Pricing (INR)

Qty.	Unit Price	Ext. Price
Cut Tape / MouseReel™ ^†
	₹36.52	₹36.52
	₹19.59	₹195.90
	₹12.70	₹1,270.00
	₹10.79	₹10,790.00
Full Reel (Order in multiples of 4000)
	₹9.46	₹37,840.00
	₹8.63	₹69,040.00
	₹8.47	₹2,03,280.00
	₹8.13	₹3,90,240.00
	₹7.89	₹7,89,000.00

† A MouseReel™ fee of ₹475.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Specifications

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	KEMET
Product Category:	Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:	Details
Capacitance:	0.1 uF
Voltage Rating DC:	50 VDC
Dielectric:	X7R
Tolerance:	20 %
Case Code - in:	0805
Case Code - mm:	2012
Height:	0.78 mm
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Product:	General Type MLCCs
Termination Style:	SMD/SMT
Termination:	Flexible (Soft)
Series:	SMD Comm X7R Flex
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	KEMET
Capacitance - nF:	100 nF
Capacitance - pF:	100000 pF
Class:	Class 2
Length:	2 mm
Package/Case:	0805 (2012 metric)
Product Type:	Ceramic Capacitors
Factory Pack Quantity:	4000
Subcategory:	Capacitors
Tradename:	FT-CAP
Type:	Surface Mount Multilayer Ceramic Chip Capacitor
Voltage Rating AC:	-
Width:	1.25 mm
Part # Aliases:	C0805X104M5RAC7800
Unit Weight:	5.500 mg

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Product Compliance

CNHTS:: 8532241000
USHTS:: 8532240020
JPHTS:: 853224000
TARIC:: 8532240000
BRHTS:: 85322410
ECCN:: EAR99

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy.

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount multilayer ceramic chip capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. Flexible termination directs circuit board stress away from the ceramic body and into the termination area, reducing the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology.

High CV Multilayer Ceramic Capacitors (MLCC)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.

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