EYG-R0309ZRAK

Panasonic
667-EYG-R0309ZRAK
EYG-R0309ZRAK

Mfr.:

Description:
Thermal Interface Products 89.5 mmx29.5 mmx0.35 mm200 W/m-K - 55 C+ 400 C

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
Non-Stocked
Factory Lead Time:
16 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹1,065.05 ₹1,065.05
₹904.78 ₹9,047.80
₹854.46 ₹17,089.20
₹842.35 ₹42,117.50
₹829.30 ₹82,930.00
₹815.33 ₹1,63,066.00
₹806.94 ₹4,03,470.00
₹799.48 ₹7,99,480.00
2,000 Quote

Product Attribute Attribute Value Select Attribute
Panasonic
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
High Compressible Graphite Sheet
Non-standard
Graphite
200 W/m-K
Gray
- 55 C
+ 400 C
89.5 mm
29.5 mm
0.35 mm
600 kPa
UL 94 V-0
EYGR
Bulk
Brand: Panasonic
Product Type: Thermal Interface Products
Factory Pack Quantity: 10
Subcategory: Thermal Management
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Compliance Codes
CAHTS:
8545900000
USHTS:
8545904000
MXHTS:
8545909900
ECCN:
EAR99
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.