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HDTM-4-08-1-S-VT-0-2

Name: Samtec HDTM-4-08-1-S-VT-0-2
Brand: Samtec
SKU: 200-HDTM4081SVT02
Price: 1244.88 INR
Availability: InStock

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Mouser No:

200-HDTM4081SVT02

Mfr. No:

HDTM-4-08-1-S-VT-0-2

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-4-08-1-S-VT-0-2 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-4-08-1-S-VT-0-2

In Stock: 18

Stock:: 18 Can Dispatch Immediately

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Factory Lead Time:: 2 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹1,244.88	₹1,244.88
	₹1,122.82	₹11,228.20
	₹998.89	₹24,972.25
	₹829.30	₹41,465.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	63
Subcategory:	Backplane Connectors

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Datasheet

HDTM-4-08-1-S-VT-0-2 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.