ATS-1043-C2-R0

Advanced Thermal Solutions
984-ATS-1043-C2-R0
ATS-1043-C2-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink+Plastic pushPIN, High Performance, Cross-Cut, 41x45x25mm

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
8 Weeks Estimated factory production time.
Minimum: 100   Multiples: 100
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹2,002.44 ₹2,00,244.00
₹1,888.76 ₹3,77,752.00
₹1,837.51 ₹9,18,755.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Bracket
Aluminum
1.9 C/W
41 mm
45 mm
25 mm
Brand: Advanced Thermal Solutions
Color: Green
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiFLOW XCut PushPIN
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW pushPIN
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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Compliance Codes
CNHTS:
8544422900
CAHTS:
8544420090
USHTS:
8544429090
TARIC:
8544429090
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

maxiFLOW™ Cross-Cut Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.

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