ATS-59007-C1-R0

Advanced Thermal Solutions
984-ATS-59007-C1-R0
ATS-59007-C1-R0

Mfr.:

Description:
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-59007-C1-R0

In Stock: 100

Stock:
100 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 100 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹2,060.93 ₹2,060.93
₹1,823.75 ₹18,237.50
₹1,736.61 ₹34,732.20
₹1,673.72 ₹83,686.00
₹1,637.78 ₹1,63,778.00
₹1,520.99 ₹3,04,198.00
₹1,480.56 ₹7,40,280.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
2.42 C/W
46 mm
35 mm
16 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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