ATS-59009-C1-R0

Advanced Thermal Solutions
984-ATS-59009-C1-R0
ATS-59009-C1-R0

Mfr.:

Description:
Heat Sinks maxiGRIP Heat Sink Assembly, 2 Side Adhesive, T412, 42.5mm Comp, 62x52x13mm

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
8 Weeks Estimated factory production time.
Minimum: 100   Multiples: 100
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹2,434.79 ₹2,43,479.00
₹2,295.96 ₹4,59,192.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
3.2 C/W
62 mm
52 mm
13 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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Compliance Codes
CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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