ATS-61450D-C1-R0

Advanced Thermal Solutions
984-ATS-61450D-C1-R0
ATS-61450D-C1-R0

Mfr.:

Description:
Heat Sinks BGA fanSINK Assembly+maxiGRIP Attachment, T412, 44.25x44.25x9.5mm, 44.25mm Dia

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
100
Expected 10-06-2026
Factory Lead Time:
8
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹1,755.51 ₹1,755.51
₹1,669.79 ₹16,697.90
₹1,587.79 ₹31,755.80
₹1,504.86 ₹75,243.00
₹1,416.34 ₹1,41,634.00
₹1,402.36 ₹2,80,472.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Fan Sink Assemblies
BGA
Snap On
Aluminum
Cross Cut Fin
3.3 C/W
45 mm
45 mm
9.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: ATS-61
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: fanSINK maxiGRIP
Type: Component
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Compliance Codes
CNHTS:
8548000090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.