ATS-VC-016-C1-R2

Advanced Thermal Solutions
984-ATS-VC-016-C1-R2
ATS-VC-016-C1-R2

Mfr.:

Description:
Liquid Cold Plates, Liquid Cooling & Heat Pipes Vapor Chamber, Acetone, Mesh Wick, Aluminum, 250mm L, 100mm W, 1.75mm H, 6W qMax

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Availability

Stock:
Non-Stocked
Factory Lead Time:
10 Weeks Estimated factory production time.
Minimum: 25   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹15,382.15 ₹3,84,553.75
₹14,823.07 ₹7,41,153.50
250 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Liquid Cold Plates, Liquid Cooling & Heat Pipes
RoHS:  
Vapor Chambers
Mesh Vapor Chamber
Aluminum
250 mm
100 mm
1.75 mm
HDD and SSD, PCs, Industrial Laswer CNC, High Heat Flux Chips, Industrial Laser Welding, Graphic Card Cooling, LED Cooling, Servers, Mobile Devices
Brand: Advanced Thermal Solutions
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Height - mm: 1.75 mm
Length - mm: 250 mm
Packaging: Bulk
Product Type: Thermal Interface Products
Series: ATS-VC
Factory Pack Quantity: 1
Subcategory: Thermal Management
Width - mm: 100 mm
Unit Weight: 76.800 g
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USHTS:
8486900000
ECCN:
EAR99

ATS-VC Aluminum Vapor Chambers

Advanced Thermal Solutions ATS-VC Aluminum Vapor Chambers are vacuum-sealed heat spreaders with a wick structure lining the inside walls. These unique cooling solutions are used in high-power density or total power applications where a traditional heat sink becomes conduction-limited. The ATS-VC vapor chambers quickly spread heat in multiple directions and allow for cooling to get close to the heat source. These vapor chambers are available in 25mm x 25mm to 250mm x 250mm dimensions and less than 6mm in thickness. The ATS-VC vapor chambers feature mesh or groove wick type and Acetone as the working fluid. These vapor chambers include no moving parts and require no external parts. The ATS-VC vapor chambers are ideal for graphic card cooling, PCs, LED cooling, mobile devices, Solid State Disk Drive (SSD) cooling, and servers.