ATS028028020-SF-9S

Advanced Thermal Solutions
984-ATS028028020SF9S
ATS028028020-SF-9S

Mfr.:

Description:
Heat Sinks BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 28x28x20mm (LxWxH)

Datasheet:
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Learn more about Advanced Thermal Solutions ATS028028020-SF-9S

Availability

Stock:
20 Can Dispatch in 20 Days
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
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Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹756.62 ₹756.62
₹676.49 ₹6,764.90
₹644.81 ₹12,896.20
₹621.51 ₹31,075.50
₹597.28 ₹59,728.00
₹563.74 ₹1,12,748.00
₹548.83 ₹2,74,415.00
₹528.33 ₹5,28,330.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
4.28 C/W
28 mm
28 mm
20 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
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Attributes selected: 0

Datasheet

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Compliance Codes
USHTS:
7616995100
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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