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MBH7BTZ42

Name: FCL Components MBH7BTZ42
Brand: FCL Components
SKU: 817-MBH7BTZ42
Price: 1967.96 INR
Availability: OutOfStock

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Mouser No:

817-MBH7BTZ42

Mfr. No:

MBH7BTZ42

Mfr.:

FCL Components

Description:

Bluetooth Modules - 802.15.1 BLE 2.1 Class2 w/Ant SingleMode

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Shipping Alert:

This item may require additional fees and documentation. Customs delays may also occur.

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 1000 Multiples: 1000

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹1,967.96	₹19,67,960.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FCL Components
Product Category:	Bluetooth Modules - 802.15.1
Delivery Restrictions:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Series:	MBH7BTZ
Protocol:	BLE, Bluetooth 2.1 + EDR
Interface Type:	GPIO, SPI, UART
Output Power:	4 dBm
Data Rate:	3 Mb/s
Receiver Sensitivity:	- 86 dBm
Frequency:	2.4 GHz
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 20 C
Maximum Operating Temperature:	+ 70 C
Antenna:	Integrated
Brand:	FCL Components
Height:	1.9 mm
Length:	17.6 mm
Modulation Technique:	2FSK, 8DPSK, DQPSK
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	2.7 V to 3.6 V
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Classic Bluetooth
Protocol - Sub GHz:	ISM
Sensitivity:	- 86 dBm
Factory Pack Quantity:	1000
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	47 mA
Supply Current Transmitting:	44 mA
Width:	10.6 mm

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Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Bluetooth® Low Energy Modules

FCL Components Bluetooth® Low Energy (BLE) Modules contain the complete verified and qualified Bluetooth low energy protocol stack, offering flexibility and a high level of customization. The BLE modules are Bluetooth V4.0 single-mode compliant and are housed in small packages. The modules feature built-in MCUs for adding upper layer profiles including private profiles and application code.