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MBH7BTZ52-E1

Name: FCL Components MBH7BTZ52-E1
Brand: FCL Components
SKU: 817-MBH7BTZ52-E1
Price: 6549.62 INR
Availability: OutOfStock

Mouser No:

817-MBH7BTZ52-E1

Mfr. No:

MBH7BTZ52-E1

Mfr.:

FCL Components

Description:

Bluetooth Modules - 802.15.1 BT iOS Module SMD type NO Antenna

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Learn more about FCL Components MBH7BTZ52-E1

Shipping Alert:

This item may require additional fees and documentation. Customs delays may also occur.

Availability

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Factory Lead Time:: Request Delivery Quote

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Ext. Price:

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Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹6,549.62	₹6,549.62
	₹6,106.09	₹61,060.90
	₹5,665.34	₹1,41,633.50
	₹5,311.26	₹5,31,126.00
250	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FCL Components
Product Category:	Bluetooth Modules - 802.15.1
Delivery Restrictions:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Series:	MBH7BTZ
Protocol:	Bluetooth 2.1 + EDR
Class:	Class 2
Interface Type:	UART
Output Power:	4 dBm
Receiver Sensitivity:	- 87 dBm
Frequency:	2.4 GHz
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Antenna:	Integrated
Brand:	FCL Components
Height:	1.9 mm
Length:	17.6 mm
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	2.7 V to 3.6 V
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth
Protocol - Sub GHz:	ISM
Sensitivity:	- 87 dBm
Factory Pack Quantity:	1
Subcategory:	Wireless & RF Modules
Width:	14 mm

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Attributes selected: 0

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Bluetooth® Low Energy Modules

FCL Components Bluetooth® Low Energy (BLE) Modules contain the complete verified and qualified Bluetooth low energy protocol stack, offering flexibility and a high level of customization. The BLE modules are Bluetooth V4.0 single-mode compliant and are housed in small packages. The modules feature built-in MCUs for adding upper layer profiles including private profiles and application code.