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2506036008Z0

Name: Fair-Rite 2506036008Z0
Brand: Fair-Rite
SKU: 623-2506036008Z0
Price: 1.49 INR
Availability: OutOfStock

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See Product Specifications

Mouser No:

623-2506036008Z0

Mfr. No:

2506036008Z0

Mfr.:

Fair-Rite

Description:

Ferrite Beads MULTI-LAYER CHIP BEAD

Datasheet:

2506036008Z0 Datasheet

ECAD Model:

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More Information

Learn more about Fair-Rite 2506036008Z0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 20 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 230000 Multiples: 230000

Unit Price:

₹-.--

Ext. Price:

₹-.--

Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 10000)
	₹1.49	₹3,42,700.00

Alternative Packaging

Mfr. Part No.:

2506036007Z0

Packaging:

Reel, Cut Tape, MouseReel

Availability:

In Stock

Price:

₹12.11

Min:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Fair-Rite
Product Category:	Ferrite Beads
RoHS:
Series:	25
Product:	Ferrite Chip Beads
Type:	Multilayer Ferrite Chip Bead
Tolerance:	25 %
Termination Style:	SMD/SMT
Packaging:	Reel
Brand:	Fair-Rite
Height:	0.8 mm
Impedance:	60 Ohms
Length:	1.6 mm
Maximum DC Current:	450 mA
Maximum DC Resistance:	250 mOhms
Maximum Operating Temperature:	+ 125 C
Minimum Operating Temperature:	- 55 C
Package/Case:	0603 (1608 metric)
Product Type:	Ferrite Beads
Factory Pack Quantity:	10000
Subcategory:	Ferrites
Test Frequency:	100 MHz
Width:	0.8 mm
Unit Weight:	2 mg

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Datasheet

2506036008Z0 Datasheet

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CNHTS:: 8548000090
USHTS:: 8548000000
TARIC:: 8504509590
ECCN:: EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.