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FH8065301567416S R3V2

Name: Intel FH8065301567416S R3V2
Brand: Intel
SKU: 607-65301567416SR3V2
Price: 4225.71 INR
Availability: OutOfStock

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Mouser No:

607-65301567416SR3V2

Mfr. No:

FH8065301567416S R3V2

Mfr.:

Intel

Description:

CPU - Central Processing Units Intel Atom Processor E3815 (512K Cache, 1.46 GHz) FC-BGA13F, Tray

Datasheet:

FH8065301567416S R3V2 Datasheet (PDF)

ECAD Model:

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Learn more about Intel FH8065301567416S R3V2

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 30 Weeks Estimated factory production time.

Long lead time reported on this product.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹4,225.71	₹4,225.71
	₹3,614.45	₹36,144.50
	₹3,462.57	₹86,564.25
	₹3,137.37	₹3,13,737.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Intel
Product Category:	CPU - Central Processing Units
RoHS:
Product:	Embedded Processors
Core:	Intel Atom E3815
Data Bus Width:	64 bit
Number of Cores:	1 Core
Package/Case:	FCBGA-1170
Maximum Clock Frequency:	1.467 GHz
Cache Memory:	512 kB
Family:	Intel Atom
Code Name:	Bay Trail
Processor Series:	E3815
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 110 C
Packaging:	Tray
Brand:	Intel
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Product Type:	CPU - Central Processing Units
Series:	E3800
Factory Pack Quantity:	1
Subcategory:	Embedded Processors & Controllers
Tradename:	Atom
Part # Aliases:	962771

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Datasheet

FH8065301567416S R3V2 Datasheet (PDF)

Technical Resources

Specification Update (PDF)

Compliance Codes

CNHTS:: 8542319090
USHTS:: 8542310045
TARIC:: 8542319000
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: Vietnam
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

E3800 Atom Processor

Intel's E3800 Atom Processor family is based on the Silvermont microarchitecture, and utilizes Intel's industry-leading 22nm process technology with 3-D Tri-Gate transistors to deliver significant improvements in computational performance and energy-efficiency in intelligent systems. It is the first system-on-chip (SoC) designed for intelligent systems, delivering outstanding compute, graphical and media performance while operating in an extended range of thermal conditions. Highlights include high I/O connectivity, integrated memory controller, virtualization, Error Correcting Code (ECC), and built-in security capabilities with a thermal design power (TDP) range of 5W to 10W. This product family is ideal for efficient imaging workflows, digital signage with secure content delivery, visually appealing interactive clients (interactive kiosks, intelligent vending, ATM and point-of-sale (POS) terminals, portable medical devices, industrial control systems, and in-vehicle infotainment (IVI) systems.
Learn More