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ECE1200-I/LD

Name: Microchip ECE1200-I/LD
Brand: Microchip Technology
SKU: 579-ECE1200-I/LD
Price: 352.22 INR
Availability: InStock

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Mouser No:

579-ECE1200-I/LD

Mfr. No:

ECE1200-I/LD

Mfr.:

Microchip Technology

Description:

I/O Controller Interface IC eSPI to LPC Bridge

View in Development Tools Selector

Datasheet:

ECE1200-I/LD Datasheet (PDF)

ECAD Model:

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Learn more about Microchip Technology ECE1200-I/LD

In Stock: 1,325

Stock:: 1,325 Can Dispatch Immediately

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Factory Lead Time:: 12 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹352.22	₹352.22

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Microchip
Product Category:	I/O Controller Interface IC
RoHS:
Mounting Style:	SMD/SMT
Package/Case:	VQFN-40
Product:	Computing I/O Controllers
Interface Type:	eSPI
Supply Voltage - Max:	1.8 V, 3.3 V
Supply Voltage - Min:	1.8 V, 3.3 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Microchip Technology
Moisture Sensitive:	Yes
Operating Supply Voltage:	1.8 V, 3.3 V
Product Type:	I/O Controller Interface IC
Factory Pack Quantity:	490
Subcategory:	Interface ICs
Type:	eSPI to LPC Bridge
Unit Weight:	700 mg

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Compliance Codes

CNHTS:: 8542399000
CAHTS:: 8542310000
USHTS:: 8542310030
ECCN:: EAR99

Origin Classifications

Country of Origin:: Thailand
Assembly Country of Origin:: Not available
Country of Diffusion:: Singapore

The country is subject to change at the time of shipment.

ECE1200 eSPI-to-LPC Bridge

Microchip ECE1200 eSPI to LPC Bridge implements the eSPI standard in boards with legacy LPC connectors and peripherals. The architecture and development of the ECE1200 ensure that industrial and embedded requirements would scale across Intel Atom^®, Intel Core™, and Intel Xeon^® platforms. These key requirements include industrial temperature support and compatibility with existing deployed modular LPC-based systems, with simultaneous eSPI and LPC support for new system architectures.