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170729-0001

Name: Molex 170729-0001
Brand: Molex
SKU: 538-170729-0001
Price: 703.45 INR
Availability: InStock

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Mouser No:

538-170729-0001

Mfr. No:

170729-0001

Mfr.:

Molex

Description:

High Speed/Modular Connectors iPass zHD Vert 1x1 Internal Assy

Datasheet:

170729-0001 Datasheet

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In Stock: 240

Stock:: 240 Can Dispatch Immediately

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Factory Lead Time:: 22 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹703.45	₹703.45

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	36 Position
Number of Rows:	4 Row
Pitch:	0.75 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	170729
Brand:	Molex
Contact Material:	Tin
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 80 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	240
Subcategory:	Backplane Connectors
Tradename:	iPass+
Voltage Rating:	48 VAC/DC
Unit Weight:	3.037 g

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Datasheet

170729-0001 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

iPass+ zHD Vertical Connectors

Molex iPass+ zHD Vertical Connectors operate at SAS-3 and Projected SAS-4 high-speed bandwidths. These low-profile Molex connectors drive next generation data rates and port densities, improving system airflow and signal integrity by eliminating mid-plane connections. Molex iPass+ zHD Connectors are 0.75mm pitch vertical connectors feature a robust and secure connection and are scalable up to 96Gbps data rates (24Gbps over four lanes).

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.