208381-1007

Molex
538-208381-1007
208381-1007

Mfr.:

Description:
Headers & Wire Housings Pico-Clasp1.0 SRVTETP GLHNat 10Ckt

Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 6600   Multiples: 6600
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹128.59 ₹8,48,694.00

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
208381
Pico-Clasp
Brand: Molex
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1100
Subcategory: Headers & Wire Housings
Part # Aliases: 2083811007 02083811007
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Attributes selected: 0

Datasheet

Models

Compliance Codes
USHTS:
8536694040
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Signal Wire-to-Wire/Wire-to-Board Connectors

Molex Signal Wire-to-Wire/Wire-to-Board Connectors and Connector Systems feature a variety of wire-to-board signal connectors that offer design flexibility. Molex Signal WTW/WTB connectors and systems are ideal for personal computers and lighting, as well as automotive and industrial applications, depending on the model.

Pico-Clasp™ Wire-to-Board Connectors

Molex Pico-Clasp™ Wire-to-Board Connectors are the smallest pitch (1.00mm) wire-to-board connectors with positive lock. Pico-Clasp 1.00mm pitch connectors come in single-row and dual-row configurations. The series offers friction and positive locks for various application needs. Pico-Clasp is designed for various connections in flat panel displays (FPD). This Molex connector system is also ideal for use in notebook PCs and other compact devices.

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.

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