PCA9527DPZ

NXP Semiconductors
771-PCA9527DPZ
PCA9527DPZ

Mfr.:

Description:
Interface - Signal Buffers, Repeaters Dual Supply 3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus

Lifecycle:
End of Life:
Scheduled for obsolescence and will be discontinued by the manufacturer.
ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
2,494
Expected 25-06-2026
Factory Lead Time:
53
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹154.68 ₹154.68
₹123.93 ₹1,239.30
₹116.48 ₹2,912.00
₹108.09 ₹10,809.00
₹104.36 ₹26,090.00
₹101.57 ₹50,785.00
Full Reel (Order in multiples of 2500)
₹91.04 ₹2,27,600.00

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NXP Semiconductors
Interface - Signal Buffers, Repeaters LEVEL TRANSL I2C BUS

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Interface - Signal Buffers, Repeaters
RoHS:  
400 kHz
5.5 V
2.7 V
- 40 C
+ 85 C
SMD/SMT
TSSOP-10
Reel
Cut Tape
Brand: NXP Semiconductors
Input Type: Open Drain
Number of Channels: 3 Channel
Operating Supply Current: 1.1 mA
Operating Supply Voltage: 2.7 V to 5.5 V
Output Type: Open Drain
Pd - Power Dissipation: 100 mW
Product Type: Signal Buffers, Repeaters
Series: PCA9527DP
Factory Pack Quantity: 2500
Subcategory: Interface ICs
Type: Bus extender
Part # Aliases: 935289105431
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Compliance Codes
CNHTS:
8542399000
USHTS:
8542390090
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
China
Country of Diffusion:
Netherlands
The country is subject to change at the time of shipment.

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.