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EYG-R1012ZLSH

Name: Panasonic EYG-R1012ZLSH
Brand: Panasonic
SKU: 667-EYG-R1012ZLSH
Price: 2746.95 INR
Availability: OutOfStock

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Mouser No:

667-EYG-R1012ZLSH

Mfr. No:

EYG-R1012ZLSH

Mfr.:

Panasonic

Description:

Thermal Interface Products 121 mmx104.5 mmx0.25 mm250 W/m-K - 55 C+ 400 C

Datasheet:

EYG-R1012ZLSH Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

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Ext. Price:

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹2,746.95	₹2,746.95
	₹2,430.13	₹24,301.30
	₹2,292.23	₹45,844.60
	₹2,230.73	₹1,11,536.50
	₹2,149.66	₹2,14,966.00
	₹2,047.16	₹4,09,432.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Panasonic
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	High Compressible Graphite Sheet
Package/Case:	Non-standard
Material:	Graphite
Thermal Conductivity:	250 W/m-K
Color:	Gray
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 400 C
Length:	121 mm
Width:	104.5 mm
Thickness:	0.25 mm
Tensile Strength:	600 kPa
Flammability Rating:	UL 94 V-0
Series:	EYGR
Packaging:	Bulk
Brand:	Panasonic
Product Type:	Thermal Interface Products
Factory Pack Quantity:	10
Subcategory:	Thermal Management

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Datasheet

EYG-R1012ZLSH Datasheet (PDF)

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.