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SH9MBGP1ATI01

Name: SMART Modular Technologies SH9MBGP1ATI01
Brand: SMART Modular Technologies
SKU: 473-SH9MBGP1ATI01
Price: 2979.9 INR
Availability: OutOfStock

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Mouser No:

473-SH9MBGP1ATI01

Mfr. No:

SH9MBGP1ATI01

Mfr.:

SMART Modular Technologies

Description:

eMMC 32GB eMMC 153-ball I-temp

Lifecycle:

End of Life:

Scheduled for obsolescence and will be discontinued by the manufacturer.

Datasheet:

SH9MBGP1ATI01 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about SMART Modular Technologies SH9MBGP1ATI01

Availability

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Ext. Price:

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Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹2,979.90	₹1,48,995.00
	₹2,899.76	₹2,89,976.00
	₹2,789.81	₹6,97,452.50

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	SMART Modular Technologies
Product Category:	eMMC
RoHS:
Package/Case:	BGA-153
Memory Size:	32 GB
Configuration:	MLC
Sequential Read:	270 MB/s
Sequential Write:	95 MB/s
Interface Type:	eMMC 5.0
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	SMART Modular Technologies
Dimensions:	11.5 mm x 13 mm
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Product Type:	eMMC
Subcategory:	Memory & Data Storage

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Datasheet

SH9MBGP1ATI01 Datasheet (PDF)

EOL

Product Discontinuation Notification 2026-4-24 (PDF)

Compliance Codes

CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: EAR99

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

DuraFlash™ BGAE240 eMMC Memory

SMART Modular Technologies DuraFlash™ BGAE240 eMMC Memory is an industrial-grade embedded memory solution in a compact BGA (Ball Grid Array) package. The BGAE240 integrates 2D-MLC NAND Flash Memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware into a single unit that provides stable, cost-effective, and high-density embedded storage. BGAE240 eMMC Memory is designed to meet the rigid requirements of the industrial, medical, and networking markets where technical support, extended life, and stable roadmaps are critical.