ISM330DLCTR

STMicroelectronics
511-ISM330DLCTR
ISM330DLCTR

Mfr.:

Description:
IMUs - Inertial Measurement Units iNEMO 6-axis IMU: 3-axis accelerometer and 3-axis gyroscope with digital output
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Learn more about STMicroelectronics ISM330DLCTR

In Stock: 2,592

Stock:
2,592
Can Dispatch Immediately
On Order:
5,000
Expected 01-03-2027
10,000
TBD
Factory Lead Time:
24
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 500
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 5000)

Pricing (INR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
₹721.21 ₹721.21
₹651.33 ₹3,256.65
₹625.24 ₹6,252.40
₹593.56 ₹14,839.00
₹572.13 ₹28,606.50
₹552.56 ₹55,256.00
₹496.65 ₹2,48,325.00
Full Reel (Order in multiples of 5000)
₹496.65 ₹24,83,250.00
† A MouseReel™ fee of ₹475.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: IMUs - Inertial Measurement Units
RoHS:  
SMD/SMT
LGA-14
6-axis
I2C, SPI
Digital
2 g, 4 g, 8 g, 16 g
16 bit
0.061 mg/LSB, 0.122 mg/LSB, 0.244 mg/LSB, 0.488 mg/LSB
- 40 C
+ 85 C
1.71 V
3.6 V
750 uA
Reel
Cut Tape
MouseReel
ISM330DLC
Brand: STMicroelectronics
Moisture Sensitive: Yes
Product Type: IMUs - Inertial Measurement Units
Range: 2000 dps
Sensing Axis: X, Y, Z
Factory Pack Quantity: 5000
Subcategory: Sensors
Unit Weight: 13.200 mg
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Attributes selected: 0

Compliance Codes
CNHTS:
8542391090
CAHTS:
8542390000
USHTS:
8542390090
TARIC:
8542399000
MXHTS:
8542399999
ECCN:
EAR99
Origin Classifications
Country of Origin:
Italy
Assembly Country of Origin:
Philippines
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

MEMS Accelerometers

STMicroelectronics MEMS Accelerometers include analog and digital sensors featuring up to ±400g acceleration full scale and from 1.71V to 3.6V supply voltage. Accelerometers are an ideal choice for ultra-low-power applications and have advanced power-saving features. Features include low-power mode, auto wake-up function, and FIFO buffer that can be used to store data. This reduces the host processor loading and system power consumption.

Industrial Motion Sensors

STMicroelectronics Industrial Motion Sensors are high-performance and ultralow-power sensing solutions for Industry 4.0 with a minimum longevity commitment of 10 years. These STMicroelectronics sensors offer high performance and quality for industrial applications like robotics, condition monitoring, industrial vehicle guidance, and stabilization. Other applications include power tools, building industrial automation, navigation, medical, and defense systems. These factory-regulated sensors result in highly stable outputs and eliminate the need for re-calibration. The sensors feature robust and highly selective testing flow to guarantee accuracy, reliability, and safety.

iNEMO-Inertial Modules

STMicroelectronics iNEMO-Inertial Modules are compact, robust, easy-to-assemble solutions compared to discrete MEMS products. iNEMO System-in-packages (SiP) combines an accelerometer, gyroscope, and magnetometer in a monolithic 6-axis or 9-axis solution. The integration of multiple sensor outputs brings motion sensing systems to the level of accuracy required for the most demanding applications. These applications include enhanced gesture recognition, gaming, augmented reality, indoor navigation, and localization-based services.

ISM330DLC iNEMO® 6-Axis Inertial Module

STMicroelectronics ISM330DLC iNEMO® 6-Axis Inertial Module is a high-performance 3D digital accelerometer and 3D digital gyroscope ideal for Industry 4.0 applications. This system-in-package module uses the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements of the STMicroelectronics ISM330DLC iNEMO® 6-Axis Inertial Module are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology. This allows the design of a trimmed dedicated circuit to match the characteristics of the sensing element.

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