ASP-222919-01

Samtec
200-ASP-222919-01
ASP-222919-01

Mfr.:

Description:
Board to Board & Mezzanine Connectors MOD. JSOM ASSY 10MM STACK - COM HPC

Lifecycle:
Factory Special Order:
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ECAD Model:
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This item may require additional fees and documentation. Customs delays may also occur.

In Stock: 980

Stock:
980 Can Dispatch Immediately
Quantities greater than 980 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹342.90 ₹342.90
₹282.34 ₹2,823.40
₹268.36 ₹26,836.00
₹251.59 ₹62,897.50
₹240.40 ₹1,20,200.00
1,000 Quote

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Board to Board & Mezzanine Connectors
Delivery Restrictions:
 This item may require additional fees and documentation. Customs delays may also occur.
RoHS:  
Accessories
10 mm
Accessory Type: Standoff
Brand: Samtec
Product Type: Board to Board & Mezzanine Connectors
Subcategory: Board to Board & Mezzanine Connectors
Tradename: COM-HPC
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Attributes selected: 0

Compliance Codes
CAHTS:
7318190000
USHTS:
7318190000
KRHTS:
7318190000
BRHTS:
73181900
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.