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HDTM-3-06-2-S-VT-5-R-3

Name: Samtec HDTM-3-06-2-S-VT-5-R-3
Brand: Samtec
SKU: 200-HDTM3062SVT5R3
Price: 952.3 INR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM3062SVT5R3

Mfr. No:

HDTM-3-06-2-S-VT-5-R-3

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-3-06-2-S-VT-5-R-3 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-06-2-S-VT-5-R-3

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹952.30	₹952.30
	₹858.87	₹8,588.70
	₹765.44	₹19,136.00
	₹624.39	₹59,941.44
	₹561.50	₹1,61,712.00
	₹518.38	₹2,73,704.64
	₹464.47	₹4,68,185.76
	₹411.47	₹8,29,523.52

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-06-2-S-VT-5-R-3 Datasheet (PDF)

USHTS:: 8536694040

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.