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IMPC-10-P

Name: Samtec IMPC-10-P
Brand: Samtec
SKU: 200-IMPC-10-P
Price: 203.13 INR
Availability: InStock

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Mouser No:

200-IMPC-10-P

Mfr. No:

IMPC-10-P

Mfr.:

Samtec

Description:

Power to the Board 2.00 mm mPOWER Discrete Wire Socket Housing

Datasheet:

IMPC-10-P Datasheet (PDF)

ECAD Model:

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Learn more about Samtec IMPC-10-P

In Stock: 839

Stock:: 839 Can Dispatch Immediately

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Factory Lead Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹203.13	₹203.13
	₹164.00	₹8,856.00
	₹140.70	₹15,195.60
	₹130.45	₹65,746.80
	₹105.29	₹1,06,132.32
	₹98.77	₹1,99,120.32
	₹84.51	₹4,22,888.04
	₹70.91	₹7,09,667.28

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Power to the Board
RoHS:
Product Type:	Power to the Board
Contact Gender:	Without Socket Contacts
Voltage Rating:	300 V
Number of Positions:	10 Position
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Pitch:	2 mm
Series:	IMPC
Packaging:	Tube
Tradename:	mPOWER
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Mounting Angle:	Straight
Number of Rows:	1 Row
Product:	Wire Housings
Factory Pack Quantity:	18
Subcategory:	Power Connectors

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Datasheet

IMPC-10-P Datasheet (PDF)

Images

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Specification Sheets

CNHTS:: 8536901100
USHTS:: 8538906000
JPHTS:: 853890000
MXHTS:: 8538900100
BRHTS:: 85389090
ECCN:: EAR99

mPOWER® Ultra Micro Power Connectors

Samtec mPOWER^® Ultra Micro Power Connectors feature 2mm power blade interconnects, delivering up to 18A (460V_AC/651V_DC maximum) in a small form factor to support board-to-board and cable-to-board applications. The mPOWER connector system provides a versatile, high-power micro solution with exceptional design flexibility across a single product family. With a wide range of stack heights, the mPOWER series integrates easily into new or existing architectures. Discrete wire cable assemblies streamline board layout while efficiently delivering power directly to the system's active components.