1827570-2

TE Connectivity
571-1827570-2
1827570-2

Mfr.:

Description:
Headers & Wire Housings RCPT CONT 22-28 AU

ECAD Model:
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In Stock: 1,62,000

Stock:
1,62,000 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 6000   Multiples: 6000
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 6000)
₹11.14 ₹66,840.00
₹10.87 ₹1,95,660.00

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Headers & Wire Housings
RoHS:  
Contacts
Cable Mount / Free Hanging
Crimp
Socket (Female)
Gold
D-1000
DYNAMIC SERIES
Component-to-Wire, Power, Signal
- 55 C
+ 105 C
Reel
Brand: TE Connectivity
Contact Material: Copper
Contact Type: Socket (Female)
Current Rating: 3 A
Product Type: Headers & Wire Housings
Factory Pack Quantity: 6000
Subcategory: Headers & Wire Housings
Voltage Rating: 125 V
Unit Weight: 101 mg
Products found:
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Attributes selected: 0

CNHTS:
8536901100
TARIC:
8536699099
CAHTS:
8536690020
USHTS:
8536904000
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Dynamic Series Ruggedized Connectors

TE Connectivity's Dynamic Series Ruggedized Connectors are designed for use in control systems and in a wide range of applications requiring high-density, signal, and power. The series features a ruggedized, industrialized package that provides connector solutions ranging from signal-level circuitry to power circuit connectivity. The portfolio includes wire-to-board, wire-to-panel, and wire-to-wire connectors with a diverse range of housings. Standard crimp and spring clamp variations of parts are available. The standardized contacts limit the amount of application tooling required. A centralized wiring system saves time and costs by offering a modular capability that allows for expansion as needed. Typical applications for TE Dynamic Series Ruggedized Connectors include industrial control, Human Machine Interface (HMI), data communication, robotics, power distribution, and more.