PICOIMX8MMQ18R40E16

TechNexion
570-PIMX8MMQ18R40E16
PICOIMX8MMQ18R40E16

Mfr.:

Description:
System-On-Modules - SOM The factory is currently not accepting orders for this product.

Lifecycle:
Factory Special Order:
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Datasheet:
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More Information
Learn more about TechNexion PICOIMX8MMQ18R40E16
This item may require additional fees and documentation. Customs delays may also occur.

In Stock: 2

Stock:
2 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 2 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹10,378.39 ₹10,378.39

Product Attribute Attribute Value Select Attribute
TechNexion
Product Category: System-On-Modules - SOM
Delivery Restrictions:
 This item may require additional fees and documentation. Customs delays may also occur.
PICO
NXP
i.MX 8M Quad
1.3 GHz
4 GB
4 GB
4.2 V to 5.25 V
Audio, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, RGMII, SPI, UART, USB, USB OTG
0 C
+ 60 C
40 mm x 37 mm
Brand: TechNexion
Product Type: System-On-Modules - SOM
Factory Pack Quantity: 1
Subcategory: Computing
Unit Weight: 181.440 g
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Attributes selected: 0 

                        
The factory is currently not accepting orders for this product.

Datasheet

Compliance Codes
USHTS:
8473301180
ECCN:
5A992.C
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

PICO-IMX8M SOM

TechNexion PICO-IMX8M SOM is a PICO System-on-Module based on the NXP Semiconductors i.MX8M Quad Core Cortex®-A53 + M4 Processor clocking up to 1.5GHz. The PICO-IMX8M also includes up to 4GB of LPDDR4 memory, 16GB eMMC, and Wi-Fi®/BLUETOOTH® connectivity. The PICO-IMX8M SOM is a purpose-built, small-footprint hardware platform equipped with a wide array of high-speed connectivity engineered to support IoT endpoints, wearable applications, appliances, drones, or industrial mobile terminals.

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