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TBD62387APG

Name: Toshiba TBD62387APG
Brand: Toshiba
SKU: 757-TBD62387APGHZ
Price: 353.07 INR
Availability: OutOfStock

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Mouser No:

757-TBD62387APGHZ

Mfr. No:

TBD62387APG

Mfr.:

Toshiba

Description:

Gate Drivers DMOS Transistor Array 8-CH 50V 0.5A

Datasheet:

TBD62387APG Datasheet (PDF)

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Availability

Stock:: 0

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On Order:: 800

Expected 23-02-2026
Factory Lead Time:: 28

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

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Ext. Price:

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹353.07	₹353.07
	₹207.53	₹2,075.30
	₹163.51	₹16,351.00
	₹134.76	₹67,380.00
	₹133.86	₹1,07,088.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Toshiba
Product Category:	Gate Drivers
RoHS:
Product:	Driver ICs - Various
Type:	Low-Side
Mounting Style:	Through Hole
Package/Case:	DIP-20
Number of Drivers:	8 Driver
Number of Outputs:	8 Output
Output Current:	500 mA
Supply Voltage - Min:	4.5 V
Supply Voltage - Max:	5.5 V
Configuration:	Inverting
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Toshiba
Output Voltage:	50 V
Pd - Power Dissipation:	1.76 W
Product Type:	Gate Drivers
Factory Pack Quantity:	800
Subcategory:	PMIC - Power Management ICs
Technology:	Si
Unit Weight:	1.400 g

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Datasheet

TBD62387APG Datasheet (PDF)

Application Notes

CNHTS:: 8542399000
CAHTS:: 8542390000
USHTS:: 8542390090
MXHTS:: 8542399999
ECCN:: EAR99

TBD62x DMOS FET Transistor Arrays

Toshiba TBD62x DMOS FET Transistor Arrays are equipped with 7-channel and 8-channel common source power DMOS arrays. The Doubled-Diffused MOSFET (DMOS FET) type sink-output driver allows high voltage and consumes less power due to reduced on-resistance of the output stage. These TBD62x transistor arrays feature 50V high output voltage, -0.5A high output current, and high efficiency. The transistor arrays operate from a -40°C to +85°C temperature range and support a -55°C to +150°C storage temperature range. These TBD62x transistor arrays are available in through-hole and surface-mount packages.