BMD-330-A-R

u-blox
377-BMD-330-A-R
BMD-330-A-R

Mfr.:

Description:
Bluetooth Modules - 802.15.1 BMD-330-A-R

ECAD Model:
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This item may require additional fees and documentation. Customs delays may also occur.

In Stock: 5,730

Stock:
5,730 Can Dispatch Immediately
Factory Lead Time:
26 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹351.29 ₹351.29
₹330.79 ₹3,307.90
Full Reel (Order in multiples of 1000)
₹330.79 ₹3,30,790.00

Product Attribute Attribute Value Select Attribute
u-blox
Product Category: Bluetooth Modules - 802.15.1
Delivery Restrictions:
 This item may require additional fees and documentation. Customs delays may also occur.
RoHS:  
BMD-330
BLE, Bluetooth 5.0
I2C, SPI, UART
4 dBm
2 Mb/s
- 96 dBm
2.4 GHz
1.7 V
3.6 V
- 40 C
+ 85 C
Reel
Cut Tape
Antenna: Integrated
Brand: u-blox
Height: 1.9 mm
Length: 14 mm
Modulation Technique: GFSK
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 1.7 V to 3.6 V
Product Type: Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1: Bluetooth LE
Sensitivity: - 96 dBm
Factory Pack Quantity: 1000
Subcategory: Wireless & RF Modules
Supply Current Receiving: 11.2 mA
Supply Current Transmitting: 10.1 mA, 15.4 mA
Width: 9.8 mm
Products found:
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Attributes selected: 0

Compliance Codes
CNHTS:
8517629990
USHTS:
8517620090
JPHTS:
851762090
TARIC:
8517620000
MXHTS:
8473300499
ECCN:
5A992.C
Origin Classifications
Country of Origin:
Austria
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

BMD-330 Modules for Bluetooth 5 LE

u-blox BMD-330 Modules for Bluetooth 5 LE are based on the nRF52810 SoC from Nordic Semiconductor and feature an ARM® Cortex™ M4 CPU, embedded 2.4GHz transceiver, and integrated antenna. The BMD-330 modules provide a complete RF solution with no additional RF design. The modules can power demanding applications while simplifying designs and reducing BOM costs for faster time to market.