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Express-CFR-E-2254ME

Name: ADLINK Technology Express-CFR-E-2254ME
Brand: ADLINK Technology
SKU: 976-XPSSCFRE2254ME
Price: 114343.97 INR
Availability: OutOfStock

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Mouser No:

976-XPSSCFRE2254ME

Mfr. No:

Express-CFR-E-2254ME

Mfr.:

ADLINK Technology

Description:

Computer-On-Modules - COM Basic size type 6 COM Express module with 9th Intel Xeon E-2254ME quad core processor at 2.6/3.8GHz with CM246 chipset, 3 SO-DIMM with ECC/non-ECC support

Datasheet:

Express-CFR-E-2254ME Datasheet

ECAD Model:

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More Information

Learn more about ADLINK Technology Express-CFR-E-2254ME

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ADLINK Technology
Product Category:	Computer-On-Modules - COM
Delivery Restrictions:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Form Factor:	PICMG COM.0
Processor Brand:	Intel
Processor Type:	Xeon E-2254ME
Chipsets:	CM246
Frequency:	2.6 GHz, 3.8 GHz
Maximum RAM Capacity:	96 GB
Cache Memory:	8 MB
Operating Supply Voltage:	8.5 V to 20 V
Interface Type:	Audio, DDI, Ethernet, HDMI, LVDS, PCIe, SATA, SPI
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 60 C
Dimensions:	125 mm x 95 mm
Brand:	ADLINK Technology
Memory Size:	96 GB
Memory Type:	DDR4
Power Consumption:	45 W
Product Type:	Computer-On-Modules - COM
Factory Pack Quantity:	1
Subcategory:	Computing

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Datasheet

Express-CFR-E-2254ME Datasheet

PCN

Compliance Codes

USHTS:: 8471500150
TARIC:: 8471500000
ECCN:: 4A994

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Express-CFR Type 6 Modules

ADLINK Technology Express-CFR Type 6 Modules support the Quad/Hexa-core 64-bit 9^th Generation Intel^® Core™ and Xeon^® processor with Mobile Intel^® QM370, HM370, and CM246 chipsets. These Express-CFR modules are COM.0 R3.0 Type 6 modules that include up to three SODIMM sockets supporting up to 96GB of DDR4 memory. The Express-CFR modules feature three DDI channels, one Low Voltage Differential Signaling (LVDS), and support up to three independent displays. These modules are specifically designed for high-performance processing graphics requirements to outsource the custom core logic of the systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. The input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel^® Optane™ memory, allowing applications access to the highest-speed storage solutions.