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FH8065301989700S R3V3

Name: Intel FH8065301989700S R3V3
Brand: Intel
SKU: 607-65301989700SR3V3
Price: 4516.18 INR
Availability: OutOfStock

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Mouser No:

607-65301989700SR3V3

Mfr. No:

FH8065301989700S R3V3

Mfr.:

Intel

Description:

CPU - Central Processing Units 64BIT MPU 8065301989 700 1.33G 1MB FCBGA

Datasheet:

FH8065301989700S R3V3 Datasheet (PDF)

ECAD Model:

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Learn more about Intel FH8065301989700S R3V3

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Intel
Product Category:	CPU - Central Processing Units
RoHS:
Product:	Embedded Processors
Core:	Intel Atom E3805
Data Bus Width:	64 bit
Number of Cores:	2 Core
Package/Case:	FCBGA-1170
Maximum Clock Frequency:	1.33 GHz
Cache Memory:	1 MB
Number of Threads:	2 Thread
TDP - Max:	3 W
Memory Size:	8 GB
Memory Type:	DDR3L-1067
Family:	Intel Atom
Code Name:	Bay Trail
Processor Series:	E3805
Embedded Options:	Embedded
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 110 C
Packaging:	Tray
Brand:	Intel
ECC Memory Supported:	Supported
Moisture Sensitive:	Yes
Number of Memory Channels:	1 Channel
Number of PCI Express Lanes:	4 Lane
PCIe Configurations:	x4, x2, x1
PCIe Revision:	Revision 2.0
Product Type:	CPU - Central Processing Units
Series:	E3805
Factory Pack Quantity:	1
Subcategory:	Embedded Processors & Controllers
Tradename:	Atom
Part # Aliases:	962772
Unit Weight:	98.236 g

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Datasheet

FH8065301989700S R3V3 Datasheet (PDF)

Compliance Codes

CNHTS:: 8542319090
USHTS:: 8542310045
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: Vietnam
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

E3800 Atom Processor

Intel's E3800 Atom Processor family is based on the Silvermont microarchitecture, and utilizes Intel's industry-leading 22nm process technology with 3-D Tri-Gate transistors to deliver significant improvements in computational performance and energy-efficiency in intelligent systems. It is the first system-on-chip (SoC) designed for intelligent systems, delivering outstanding compute, graphical and media performance while operating in an extended range of thermal conditions. Highlights include high I/O connectivity, integrated memory controller, virtualization, Error Correcting Code (ECC), and built-in security capabilities with a thermal design power (TDP) range of 5W to 10W. This product family is ideal for efficient imaging workflows, digital signage with secure content delivery, visually appealing interactive clients (interactive kiosks, intelligent vending, ATM and point-of-sale (POS) terminals, portable medical devices, industrial control systems, and in-vehicle infotainment (IVI) systems.
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