2485264-2

TE Connectivity
571-2485264-2
2485264-2

Mfr.:

Description:
IC & Component Sockets DIP IC SOCKET 14P-Sn

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 7,097

Stock:
7,097 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹141.05 ₹141.05
₹120.39 ₹1,203.90
₹106.01 ₹2,650.25
₹99.72 ₹9,573.12
₹95.23 ₹24,378.88
₹90.74 ₹46,458.88
₹83.46 ₹85,463.04
₹78.16 ₹1,97,588.48
₹75.47 ₹3,79,161.28

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: IC & Component Sockets
RoHS:  
Sockets
14 Position
2 Row
DIP Socket
2.54 mm
Through Hole
Tin
7.62 mm
- 55 C
+ 125 C
Tube
Brand: TE Connectivity
Contact Material: Copper
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Mounting Style: PCB Mount
Product Type: IC & Component Sockets
Factory Pack Quantity: 32
Subcategory: IC & Component Sockets
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Attributes selected: 0

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CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.