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FGD966XAAMD

Name: Quectel FGD966XAAMD
Brand: Quectel
SKU: 277-FGD966XAAMD
Price: 1144.25 INR
Availability: OutOfStock

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See Product Specifications

Mouser No:

277-FGD966XAAMD

Mfr. No:

FGD966XAAMD

Mfr.:

Quectel

Description:

Multiprotocol Modules NXP platform, SDIO Interface

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FGD966XAAMD Datasheet

ECAD Model:

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More Information

Learn more about Quectel FGD966XAAMD

Availability

Stock:: 0

You can still purchase this product for backorder.

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On Order:: 100

Expected 04-12-2026
Factory Lead Time:: 32

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

₹-.--

Ext. Price:

₹-.--

Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹1,144.25	₹1,144.25
	₹993.30	₹9,933.00
	₹941.12	₹23,528.00
	₹869.37	₹86,937.00
	₹826.51	₹2,06,627.50
	₹796.69	₹3,98,345.00
Full Reel (Order in multiples of 1000)
	₹759.42	₹7,59,420.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Quectel
Product Category:	Multiprotocol Modules
Frequency:	2.4 GHz, 5 GHz
Interface Type:	SPI, UART, USB
Supply Voltage - Min:	3.14 V
Supply Voltage - Max:	3.46 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	12 mm x 12 mm x 2 mm
Protocol - Bluetooth, BLE - 802.15.1:	BLE 5.4
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac/ax
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Quectel
Data Rate:	114.7 Mb/s
Operating Supply Voltage:	3.3 V
Product Type:	Multiprotocol Modules
Factory Pack Quantity:	1000
Subcategory:	Wireless & RF Modules
Type:	Wi-Fi 6, BLE 5.4

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Datasheet

FGD966XAAMD Datasheet

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

FGD966X Wi-Fi 6, BLE 5.4, & 802.15.4 Module

Quectel FGD966X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Module is a high-performance module in an LGA package with an ultra-compact 12mm x 12mm x 2mm size. This module supports MCS 0–MCS 9 rates over a 20MHz bandwidth with 256QAM and 2.4GHz/5GHz Wi-Fi bands. The FGD966X module is designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the module to be easily embedded in size-constrained applications, providing reliable connectivity. The module includes an integrated shielding cover and a laser-engraved label with improved heat dissipation and indelible markings.