1-2007637-5

TE Connectivity
571-1-2007637-5
1-2007637-5

Mfr.:

Description:
I/O Connectors SFP+assy 2x2 Sp Fing 4LP EMI Enhanced

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In Stock: 139

Stock:
139 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹3,086.90 ₹3,086.90
₹2,701.49 ₹27,014.90
₹2,219.95 ₹44,399.00
₹2,206.47 ₹2,20,647.00
560 Quote

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: I/O Connectors
RoHS:  
Cages
Female
80 Position
Gold
Through Hole
Press Fit
Horizontal
SFP+
- 55 C
+ 105 C
Bulk
Brand: TE Connectivity
Contact Material: Copper Alloy
Features: Cage assembly with integrated connector, and 4 light pipes
Flammability Rating: UL 94 V-0
Housing Material: Liquid Crystal Polymer (LCP)
Number of Ports: 4 Port
Product Type: I/O Connectors
Factory Pack Quantity: 20
Subcategory: I/O Connectors
Type: SFP+
Unit Weight: 16.200 g
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Attributes selected: 0

CNHTS:
8536901100
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.