+ 150 C IC & Component Sockets

Results: 87
Select Image Part #
 Mfr.
Description Datasheet Availability Pricing (INR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Number of Rows
Type
Pitch
Termination Style
Contact Plating
Row Spacing
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads
Datasheet
18In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 14 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
Datasheet
29In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
Datasheet
29In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 20 Contact Qty.
Datasheet
24In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 20 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 20 Leads
Datasheet
18In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 20 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 24 Leads
Datasheet
18In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 24 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
Yamaichi Electronics IC & Component Sockets 48 PIN QFN 0.50MM, W/ GROUND PIN 3In Stock
Min.: 1
Mult.: 1
QFN Sockets 48 Position Chip Carrier 0.5 mm SMD/SMT Gold - 40 C + 150 C IC610
Yamaichi Electronics IC & Component Sockets 48Pin QFP Burn-in Skt 0.50 pitch
Datasheet
5Expected 16-04-2026
Min.: 1
Mult.: 1

QFP Sockets 48 Position 0.5 mm SMD/SMT Gold - 40 C + 150 C IC234 Bulk
3M Electronic Solutions Division IC & Component Sockets ZIP STRIP - AXIAL
Datasheet
10Expected 01-06-2026
Min.: 1
Mult.: 1

35 Position Through Hole Gold - 55 C + 150 C Each


Aries Electronics IC & Component Sockets 24 PIN W/HANDLE
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 50
Mult.: 10

DIP / SIP Sockets 24 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 150 C
Aries Electronics IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
Datasheet
Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 7.62 mm - 65 C + 150 C X55X
Aries Electronics IC & Component Sockets QUICK RELEASE 28 PIN GOLD
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 7.62 mm - 65 C + 150 C X57X
Aries Electronics IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 54
Mult.: 9

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
Aries Electronics IC & Component Sockets QUICK RELEASE 28 PIN GOLD
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X57X
Aries Electronics IC & Component Sockets DIP TEST SCKT GOLD 40 PINS
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 35
Mult.: 7

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
Yamaichi Electronics IC & Component Sockets Open Top Sckt - QFP 64 P Cnt, 0.5 Pitch
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

QFP Sockets 64 Position Socket 0.5 mm Through Hole Gold - 40 C + 150 C IC357
Yamaichi Electronics IC & Component Sockets Open Top Sckt - QFP 80 P Cnt, 0.65 Pitch
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

QFP Sockets 80 Position Socket 0.65 mm Through Hole Gold - 40 C + 150 C IC357
Yamaichi Electronics IC & Component Sockets Open Top Sckt - QFP 100 P Cnt, 0.5 Pitch
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

QFP Sockets 100 Position Open Frame 0.5 mm Through Hole Gold - 40 C + 150 C IC357
Yamaichi Electronics IC & Component Sockets Open Top Sckt - QFP 128 P Cnt, 0.4 Pitch
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

QFP Sockets 128 Position Socket 0.4 mm Through Hole Gold - 40 C + 150 C IC357
Yamaichi Electronics IC & Component Sockets 24 PIN TSOP 0.65 MM
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

SOP Sockets 24 Position Chip Carrier 0.65 mm SMD/SMT Gold - 40 C + 150 C IC51
Yamaichi Electronics IC & Component Sockets 484 PIN MBGA 1.00 MM PITCH
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

Test & Burn-In Sockets 484 Position MGBA 1 mm SMD/SMT Gold - 55 C + 150 C
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 18 Contact Qty.
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 18 Position 2.54 mm Through Hole Gold - 55 C + 150 C
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 18 Contact Qty.
Datasheet
Non-Stocked
Min.: 30
Mult.: 10

Zero Insertion Force (ZIF) Sockets 18 Position Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 22 Contact Qty.
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 22 Position Through Hole Gold - 55 C + 150 C
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 24 Contact Qty.
Datasheet
Non-Stocked
Min.: 40
Mult.: 10

Zero Insertion Force (ZIF) Sockets 24 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each