SFEM004GB2ED1TO-I-5E-111-STD

Swissbit
922-609264
SFEM004GB2ED1TO-I-5E-111-STD

Mfr.:

Description:
eMMC Industrial SD Card, S-50, 512 GB, 3D TLC Flash, -40 C to +85 C

Lifecycle:
End of Life:
Scheduled for obsolescence and will be discontinued by the manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 3

Stock:
3 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹5,982.16 ₹5,982.16
₹5,593.60 ₹55,936.00
₹5,412.83 ₹1,35,320.75
₹5,286.10 ₹2,64,305.00
₹5,224.60 ₹5,22,460.00

Product Attribute Attribute Value Select Attribute
Swissbit
Product Category: eMMC
RoHS:  
EM-30
BGA-153
4 GB
3D TLC
320 MB/s
240 MB/s
eMMC 5.1
1.7 V
3.6 V
- 40 C
+ 85 C
Bulk
Brand: Swissbit
Dimensions: 13 mm x 11.5 mm x 1.2 mm
Mounting Style: SMD/SMT
Product Type: eMMC
Factory Pack Quantity: 1
Subcategory: Memory & Data Storage
Part # Aliases: 609264
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

Compliance Codes
CAHTS:
8542320040
USHTS:
8542320051
MXHTS:
8542320299
ECCN:
3A991.b.1.a
Origin Classifications
Country of Origin:
Germany
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EM-30 Series eMMC Memory Devices

Swissbit EM-30 Series eMMC Memory Devices are robust, reliable, and cost-efficient memory solution for embedded applications. These memory devices are fully compliant with JEDEC e·MMC 5.1 Standard (JESD84-B51) and come in 4GB to 256GB device density with multiple partitions in 3D TLC. The EM-30 eMMC memory devices feature a BGA package that is optimized for the most demanding industrial and automotive applications. These memory devices offer solder down form factor for embedded systems delivering performance known from large SSDs at a 3D TLC NAND price point. The 3D TLC NAND price point combined with a smart set of features supporting long-lasting data integrity and reduced total cost of ownership. Typical applications include embedded systems, automotive, EV charging, POS/POI terminals, factory/industrial automation, routers and switches, medical systems, and Internet of Things (IoT).