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08EP08-N3GTC32-GA67

Name: Kingston 08EP08-N3GTC32-GA67
Brand: Kingston
SKU: 524-N3GTC32-GA67
Price: 3032.1 INR
Availability: InStock

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Mouser No:

524-N3GTC32-GA67

Mfr. No:

08EP08-N3GTC32-GA67

Mfr.:

Kingston

Description:

Multichip Packages 8GB+8Gb 136 ball ePoP

Datasheet:

08EP08-N3GTC32-GA67 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Kingston 08EP08-N3GTC32-GA67

In Stock: 32

Stock:: 32 Can Dispatch Immediately

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Factory Lead Time:: 5 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹3,032.10	₹3,032.10
	₹2,806.60	₹28,066.00
	₹2,716.76	₹81,502.80
	₹2,650.28	₹1,59,016.80
	₹2,583.80	₹2,71,299.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Kingston
Product Category:	Multichip Packages
RoHS:
Memory Size:	8 Gbit, 8 Gbit
Package/Case:	FBGA-136
Mounting Style:	SMD/SMT
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Brand:	Kingston
Interface Type:	eMMC 5.1
Moisture Sensitive:	Yes
Packaging:	Tray
Product Type:	Multichip Packages
Factory Pack Quantity:	15
Subcategory:	Memory & Data Storage
Unit Weight:	162 mg

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Datasheet

08EP08-N3GTC32-GA67 Datasheet (PDF)

CNHTS:: 8542329090
CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: EAR99

Embedded Flash

Kingston Technology Embedded Flash is an embedded, non-volatile memory system consisting of both Flash memory and a Flash memory controller. The Embedded Flash products simplify the application interface design and frees the host processor from low-level Flash memory management. The modules are ideal for industrial and embedded applications, including consumer electronics. Kingston Technology Embedded Flash offers a quick interface design and qualification process, reducing time to market and supporting future Flash device offerings. The I-Temp Flash memory provides JEDEC eMMC5.1 features and is backward compatible with earlier eMMC standards. It has all the benefits of standard Flash, plus the operating temperature range meets industrial temperature requirements of -40°C to +85°C, ideal for outdoor surveillance, factory automation, transportation, and other applications in fluid environmental conditions.

ePOP & eMCP Multi-Chip Package Memory Devices

Kingston ePOP and eMCP Multi-Chip Package Memory Devices combine e.MMC™storage (JESD84-B51) and low power DDR4X(JESD209-4-1)/DDR3 (JESD209-3B) Synchronous Dynamic RAM. The e.MMC™ part is an embedded flash memory storage solution with an e.MMC™ interface. The e.MMC™ controller directly manages NAND flash, including wear-leveling, end-to-end error control, IOPS optimization, and read sensing. These devices are available in an 8mm x 9.5mm or 10mm x 10mm package. The ePOP and eMCP devices are used in mobile communications applications.