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KC-LINK™ Capacitors with KONNEKT™ Technology
KEMET KC-LINK™ Capacitors with KONNEKT™ Technology are surface-mount capacitors designed for high-efficiency and high-density power applications. The KONNEKT high-density packaging technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface-mount multichip solution for high-density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well-suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.