congatec Thermal Management

Results: 253
Select Image Part # Mfr. Description Datasheet Availability Pricing (INR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
congatec CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. 5In Stock
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mBT10 thread 24In Stock
Min.: 1
Mult.: 1
JUMPtec Heat Sinks HSP COMe-mAL10 E2 slim through 5In Stock
Min.: 1
Mult.: 1
congatec Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm 24In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded 46In Stock
Min.: 1
Mult.: 1

congatec conga-TCR8/CSA-HP-B
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1In Stock
Min.: 1
Mult.: 1

congatec SMX8-Plus/HSP-B
congatec Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. 3In Stock
Min.: 1
Mult.: 1

congatec HPC/cALP-CSA-HP-B
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1In Stock
Min.: 1
Mult.: 1
congatec TCV2/HSP-HP-B
congatec Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. 2In Stock
Min.: 1
Mult.: 1
JUMPtec 34014-0000-99-3
JUMPtec Heat Sinks HSP COMe-mRP10 Cu-core slim through 3In Stock
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers COMe Active Uni Cooler2 (w/o HSP) 53In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 120In Stock
152Expected 20-04-2026
Min.: 1
Mult.: 1
JUMPtec 51099-0000-99-1
JUMPtec CPU & Chip Coolers SMARC Passive Uni Cooler (w/o HSP) 105In Stock
Min.: 1
Mult.: 1
JUMPtec CPU & Chip Coolers HSP COMe-cAP6 Cu-core threaded
1On Order
Min.: 1
Mult.: 1

JUMPtec 34006-0000-99-2
JUMPtec Heat Sinks HSP COMe-mBT10 slim thread
3Expected 26-02-2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
2Expected 21-07-2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
2Expected 21-07-2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU & Chip Coolers Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
2Expected 20-08-2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-HSP-B
congatec Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
2Expected 21-07-2026
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded. Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
congatec Heat Sinks Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are bore hole 2.7mm Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks *Heatspreader for Pico ITX board conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1