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THERM-A-GAP™ PAD 60 6.0W/m-K Low Force Gap Pads
Parker Chomerics THERM-A-GAP™ PAD 60 Low Force Gap Pads offer 6.0W/m-K thermal conductivity, excellent heat transfer, and low compression forces, all while maintaining conformability between mating surfaces. These high-performance, thermally conductive gap filler pads provide an effective thermal interface between heat sinks and electronic devices where uneven surfaces, rough surface textures, and air gaps may exist. Additional features include ultra-low outgassing, UL 94V-0 flammability rating, and easy application. The "A" version of these gap pads has an aluminum foil carrier with pressure-sensitive adhesive (PSA) for permanent attachment. The THERM-A-GAP PAD 60 series from Parker Chomerics is ideal for 5G and telecom equipment, smart home devices, laptops, power supplies, and automotive electronic control units (ECUs).
