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CYT3DLABBBQ1AESGST

Name: Infineon CYT3DLABBBQ1AESGST
Brand: Infineon Technologies
SKU: 726-CYT3DLABBBQ1AEST
Price: 2131.03 INR
Availability: OutOfStock

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Mouser No:

726-CYT3DLABBBQ1AEST

Mfr. No:

CYT3DLABBBQ1AESGST

Mfr.:

Infineon Technologies

Description:

ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH

Datasheet:

CYT3DLABBBQ1AESGST Datasheet (PDF)

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	ARM Microcontrollers - MCU
RoHS:
Series:	CYT3DL
Mounting Style:	SMD/SMT
Package/Case:	TEQFP-216
Core:	ARM Cortex M0+, ARM Cortex M7
Program Memory Size:	4.06 MB
Data Bus Width:	32 bit
ADC Resolution:	12 bit
Maximum Clock Frequency:	100 MHz, 240 MHz
Number of I/Os:	148 I/O
Data RAM Size:	384 kB
Supply Voltage - Min:	1.09 V
Supply Voltage - Max:	1.21 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Reel
Analogue Supply Voltage:	2.7 V to 5.5 V
Brand:	Infineon Technologies
Data RAM Type:	SRAM
Data ROM Size:	64 kB
Data ROM Type:	ROM
Interface Type:	CAN FD, Ethernet, I2C, LIN, SPI, UART, Video
Moisture Sensitive:	Yes
Number of ADC Channels:	48 Channel
Number of Timers/Counters:	50 x 16 bit, 32 x 32 bit
Product Type:	ARM Microcontrollers - MCU
Program Memory Type:	Flash
Factory Pack Quantity:	300
Subcategory:	Microcontrollers - MCU
Tradename:	TRAVEO
Watchdog Timers:	Watchdog Timer
Part # Aliases:	CYT3DLABBBQ1AESGST SP005862830

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Datasheet

CYT3DLABBBQ1AESGST Datasheet (PDF)

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Compliance Codes

ECCN:: 5A992.C

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: Taiwan
Country of Diffusion:: Singapore

The country is subject to change at the time of shipment.

TRAVEO™ T2G Cluster

Infineon Technologies TRAVEO™ T2G Cluster MCUs are designed to offer extensive scalability and high performance for automotive applications. These MCUs are fortified with up to two Arm^® Cortex^®-M7 cores, each clocked at up to 320MHz, delivering a powerful 1500 DMIPS. They also feature impressive memory capacities, with up to 6MB of flash memory and 4MB of VRAM, ensuring ample storage and efficient data handling. Additionally, the TRAVEO™ T2G Cluster comes equipped with a 2.5D graphics engine, enabling advanced graphical displays and enhancing the overall user experience in automotive environments. High processing power, substantial memory, and advanced graphics capabilities make the TRAVEO T2G Cluster a robust solution for modern automotive systems.

CYT3DL TRAVEO™ T2G 32-Bit Automotive MCUs

Infineon Technologies CYT3DL TRAVEO™ T2G 32-Bit Automotive MCUs are dedicated to automotive systems such as instrument clusters and Head-Up Displays (HUD). The CYT3DL MCUs feature a 2D graphics engine, sound processing, an Arm® Cortex®-M7 CPU running up to 240MHz for primary processing, and an Arm Cortex-M0+ CPU for peripheral/security processing. The MCUs include a WVGA GFX and are available in two unique packages: 216-pin TEQFP and 272-ball BGA. The Infineon TRAVEO T2G CYT3DL family products contain embedded peripherals supporting controller area networks with a flexible data rate (CAN FD), local interconnect networks (LIN), clock extension peripheral interfaces (CXPI), and Ethernet. The devices are manufactured using an advanced 40nm process. The CYT3DL TRAVEO T2G 32-Bit Automotive MCUs incorporate Infineon's low-power flash memory and multiple high-performance analog/digital peripherals and create a secure computing platform.

32-bit TRAVEO™ T2G Arm® Cortex® Microcontrollers

Infineon Technologies 32-bit TRAVEO™ T2G Arm^® Cortex^® Microcontroller offers cutting-edge performance, safety, and security features for smart green mobility and safety-critical industry applications. These MCUs are built using single Arm^® Cortex^®-M4F and dual Cortex-M7F and have an enhanced performance of 1500DMIPS in the TRAVEO T2G Arm family. The TRAVEO automotive MCUs offer scalability across memory size and pin count. IP compatibility enables customers to design and develop systems using a single-platform MCU solution. These MCUs possess advanced security features like a Hardware Security Module (HSM), dedicated Cortex-M0+ for secure processing, and embedded flash in dual bank mode for Firmware Over-the-Air (FOTA) requirements.