Infineon Technologies CYT4BF TRAVEO™ T2G 32-bit Automotive MCUs

Infineon Technologies CYT4BF TRAVEO™ T2G 32-bit Automotive MCUs target automotive systems such as high-end body-control units, zone control, and sound systems. CYT4BF features two Arm® Cortex®-M7 CPUs for primary processing and an Arm® Cortex®-M0+ CPU for peripheral and security processing. These devices contain embedded peripherals supporting a Controller Area Network with Flexible Data (CAN FD) rate, a Local Interconnect Network (LIN), Gigabit Ethernet, and FlexRay. TRAVEO™ T2G devices are manufactured on an advanced 40nm process. CYT4BF incorporates a low-power flash memory and multiple high-performance analog and digital peripherals. The Infineon Technologies CYT4BF TRAVEO™ T2G 32-bit Automotive MCUs enable the creation of secure computing platforms.

Features

  • CPU subsystem
    • 2x 350MHz (maximum) 32-bit Arm Cortex-M7 CPU, each with
      • Single-cycle multiply
      • Single/double-precision floating point unit (FPU)
      • Memory protection unit (MPU)
      • 16KB instruction and 16KB data tightly coupled memories (TCM)
    • 100MHz (maximum) 32-bit Arm Cortex M0+ CPU with
      • Single-cycle multiply
      • Memory protection unit
    • Inter-processor communication in hardware
    • 3x DMA controllers
      • Peripheral DMA controller #0 (P-DMA0) with 143x channels
      • Peripheral DMA controller #1 (P-DMA1) with 65x channels
      • Memory DMA controller #0 (M-DMA0) with 8x channels
  • Integrated memories
    • 8384KB of code-flash with additional 256KB of work-flash
      • Read-While-Write (RWW) allows updating the code-flash/work-flash while executing code from it
      • Single- and dual-bank modes (specifically for Firmware update Over The Air [FOTA])
      • Flash programming through the SWD/JTAG interface
    • 1024KB of SRAM with selectable retention granularity
  • Cryptography engine
    • Supports Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM)
    • Secure boot and authentication
    • AES: 128-bit blocks, 128-/192-/256-bit keys
    • 3DES: 64-bit blocks, 64-bit key
    • Vector unit supporting asymmetric key cryptography such as Rivest-Shamir-Adleman (RSA) and Elliptic Curve (ECC)
    • SHA-1/2/3: SHA-512, SHA-256, and SHA-160 with variable length input data
    • CRC: supports CCITT CRC16 and IEEE-802.3 CRC32
    • True random number generator (TRNG) and pseudo-random number generator (PRNG)
    • Galois/Counter Mode (GCM)
  • Functional safety for ASIL-B
  • Low-power 2.7V to 5.5V operation
  • Wakeup support
  • Multiple clock sources
  • Communication interfaces
  • External memory interface
  • SDHC interface
  • Audio interface
  • Timers
    • Up to 102x 16-bit and 16x 32-bit timer/counter pulse-width modulator (TCPWM) blocks
    • Up to 16x Event Generation (EVTGEN) timers supporting cyclic wake-up from DeepSleep, events trigger a specific device operation (such as execution of interrupt handler, a SAR ADC conversion, and so on)
  • Real-time clock (RTC)
  • I/O
    • Up to 240x programmable I/Os
    • 3x I/O types
  • Regulators
    • Generates 1.1V nominal core supply from a 2.7V to 5.5V input supply
    • 3x types of regulators
  • Programmable analog
    • 3x SAR A/D converters with up to 99x external channels (96x I/Os + 3x I/Os for motor control)
    • Each ADC supports 12-bit resolution and sampling rates of up to 1Msps
    • Each ADC also supports up to 6x internal analog inputs such as
    • Each ADC supports addressing external multiplexers
    • Each ADC has a sequencer supporting autonomous scanning of configured channels
    • Synchronized sampling of all ADCs for motor-sense applications
  • Smart I/O
    • Up to 5x Smart I/O blocks, which can perform Boolean operations on signals going to and from I/Os
    • Up to 36x I/Os (GPIO_STD) supported
  • Debug interface
    • JTAG controller and interface compliant with IEEE-1149.1-2001
    • Arm® SWD (serial wire debug) port
    • Supports Arm® Embedded Trace Macrocell (ETM) trace
  • Compatible with industry-standard tools, GHS/MULTI or IAR EWARM for code development and debugging
  • Package options
    • 176-TEQFP, 24mm × 24mm × 1.7mm (maximum), 0.5mm lead pitch
    • 272-BGA, 16mm × 16mm × 1.7mm (maximum), 0.8mm ball pitch
    • 320-BGA, 17mm × 17mm × 1.7mm (maximum), 0.8mm ball pitch
  • Qualified for automotive applications according to AEC-Q100

Applications

  • Body control modules and body domain control
  • Zone control
  • Lighting systems
  • Cockpit domain control sub-systems
  • Sound systems

Block Diagram

Block Diagram - Infineon Technologies CYT4BF TRAVEO™ T2G 32-bit Automotive MCUs
Published: 2024-06-20 | Updated: 2026-10-15