Infineon Technologies HybridPACK™ HD CoolSiC™ MOSFET Module
Infineon Technologies FF01MR14A60MA2XT HybridPACK™ HD CoolSiC™ MOSFET Module is a 1400V half-bridge power module for electric commercial vehicle drivetrains. The device integrates high-current CoolSiC MOSFET technology with low on-resistance, low switching losses, and a low-inductance design. Infineon implements the .XT interconnection technology to support high power-cycling capability and long service life in demanding heavy-duty applications.
The Infineon FF01MR14A60MA2XT Module combines a direct-cooled PinFin baseplate and temperature sensor for thermal management and system monitoring. High creepage and clearance distances, strong vibration resistance, laser-weldable power terminals, and PressFIT auxiliary contacts support robust inverter integration. The HybridPACK HD platform is designed for heavy-duty electric commercial vehicles and future high-voltage battery architectures.
Features
- CoolSiC MOSFET technology with .XT interconnection
- Half-bridge power module configuration
- Low on-resistance for reduced conduction losses
- Low switching losses for efficient power conversion
- Low-inductance design for high-performance switching
- High power-cycling capability
- High creepage and clearance distances
- High vibration resistance
- Direct-cooled PinFin baseplate
- Integrated temperature sensor
- Power terminals suitable for laser welding
- Auxiliary terminals with PressFIT contact technology
- AQG 324 qualification
- Vibration resistance qualified according to ISO 16750-3
- IPC-9797 qualification
- RoHS-compliant
Specifications
- Drain-source voltage of 1400V
- Implemented drain current of 850A
- Continuous DC drain current of 785A at 175°C junction temperature and 65°C fluid temperature
- Repetitive peak drain current of 1700A
- Operating junction temperature up to +175°C
- Recommended on-state gate voltage range of 15V to 18V
- Recommended off-state gate voltage range of -5V to -3V
- Drain-source on-resistance at 850A and 15V gate voltage
- 1.16mΩ typical at 25°C junction temperature
- 1.58mΩ maximum at 25°C junction temperature
- 1.77mΩ typical at 125°C junction temperature
- 2.26mΩ typical at 175°C junction temperature
- Drain-source on-resistance at 850A and 18V gate voltage
- 1.36mΩ typical at 25°C junction temperature
- 1.65mΩ typical at 125°C junction temperature
- 2.15mΩ typical at 175°C junction temperature
- Total gate charge of 2.2µC
- Internal gate resistance of 0.17Ω
- Typical module stray inductance of 6.5nH
- Module lead resistance of 0.4mΩ per switch
- Isolation test voltage of 3.4kVRMS for 1 minute
- Minimum creepage distances
- 16.6mm from terminal to baseplate
- 17.6mm from terminal to terminal
- Minimum clearances
- 14.0mm from terminal to baseplate
- 13.2mm from terminal to terminal
- Comparative tracking index of 175
- Maximum cooling-circuit pressure of 3bar
- Storage temperature range of -40°C to +125°C
- Maximum baseplate operating temperature of +150°C
- Module weight of 435g
- HybridPACK HD package
Typical Application
Dimensions mm
