Infineon Technologies XHP™ 2 1700V IGBT Modules
Infineon Technologies XHP™ 2 1700V IGBT Modules are high-performance power devices built on a scalable platform optimized for demanding high-power systems. The XHP 2 package features a low-inductive, multi-package housing that minimizes parasitic inductance and enables clean switching behavior. These characteristics help reduce voltage overshoot and switching losses in high-current applications. Combined with advanced TRENCHSTOP™ IGBT technologies and .XT interconnection, these modules deliver high current density, low saturation voltage, and robust thermal cycling capability, supporting reliable operation at elevated junction temperatures up to +175°C. High power density and a scalable mechanical design allow consistent integration across different converter platforms while maintaining efficiency and long service life.
Features
- XHP2 module with TRENCHSTOP™ IGBT8 and emitter-controlled eight diode and NTC
- Low switching losses
- High current density
- Low inductive design
- High creepage and clearance distances
- High power and thermal cycling capability
- High power density
- Package with CTI > 600
- Qualified for industrial applications per IEC 60747, 60749, and 60068
- RoHS-compliant
Applications
- High-power converters
- Wind turbines
- Motor drives
- Traction
Specifications
- 1700V maximum collector-emitter voltage
- 1400A or 2000A collector current
- ±20V maximum gate-emitter peak voltage
- 1400kW or 2200kW maximum power dissipation
- 4.0kV isolation test voltage
- 10nH typical stray inductance module
- 1.5nH typical main emitter inductance 1
- 3.5nH typical main emitter inductance 2
- 0.27mΩ to 0.41mΩ typical module lead resistance range
- 3Nm to 6Nm mounting torque range for module mounting
- Terminal connection torque
- 0.9Nm to 1.1Nm for M3 screws
- 8Nm to 10Nm for M8 screws
- CU module baseplate material
- +150°C maximum baseplate operating temperature
Datasheets
Circuit Diagram
