Microchip Technology BZPACK mSiC® Power Modules
Microchip Technology BZPACK mSiC® Power Modules are silicon carbide modules for demanding power conversion applications that need high efficiency, reliability, and manufacturing scalability. BZPACK modules are constructed using industry-standard footprints with pin compatibility and support multiple power topologies. These modules are tested to meet HV-H3TRB standards, providing confidence for deployments in industrial and renewable energy applications. Microchip Technology BZPACK mSiC Modules offer aluminum oxide (AI2O3) and aluminum nitride (AIN) substrate options for stable RDS(on) over temperature and optimized thermal performance.
Features
- Built-on industry-standard footprints
- HV-H3TRB reliability
- Flexible, production-optimized packaging
- Superior thermal management and insulation
- Supports multiple topologies
- Integrated gate resistors and stable RDS(on) across temperature ranges
- Versatile application support
- AI2O3 and AIN substrate options
Applications
- Renewable energy systems
- Industrial power
- Heavy transportation
- Aerospace and defense
Published: 2026-03-23
| Updated: 2026-03-25