New Thermal Interface Products
Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs® support 20% to 50% compressibility with reworkable and pick-and-place functionality. Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs feature 30W/m-K conductivity, a 77-hardness rating, and 1000hr thermal cycling capabilities. The GAP PADs are designed for integration in telecom infrastructure, aerospace and satellite systems, and automotive advanced driver assistance systems (ADAS).
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Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs®Support 20% to 50% compressibility with reworkable and pick-and-place functionality.13-10-2026
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Qnity Tgrease™ 3000 Thermal GreaseSupports higher operating temperatures (+200°C), especially for SiC and GaN power semiconductors.21-08-2026 -
StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.08-04-2026 -
Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.02-02-2026 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.06-11-2025 -
Qnity Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.15-09-2025 -
Qnity Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.09-09-2025 -
Qnity Tputty™ SF560 1-Part Dispensable Gap FillersOffers thermal conductivity of 5.6W/mK, along with superior thermal resistance.25-08-2025 -
Wakefield Thermal WTC/WTI Omnipad Thermal InsulatorsHighly efficient and designed for semiconductor-to-heat sink interfaces.23-07-2025 -
Wakefield Thermal CD ulTIMiFlux™ Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces23-07-2025 -
Qnity Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.25-10-2024 -
Qnity Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10-09-2024 -
Qnity Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10-09-2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30-05-2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27-05-2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.18-01-2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.30-10-2023 -
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal PadsLow thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.18-10-2023 -
LeaderTech TGN Ultra-Thin Thermal PadsFeatures low thermal resistance and is manufactured by combining graphene and silicone.18-10-2023 -
LeaderTech TCI Composite Indium SheetTransitions from solid to liquid at its melting point and back to solid again at room temperature.18-10-2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27-09-2023 -
Qnity CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.08-09-2023 -
Bergquist Company Data Centre ApplicationsAdvanced materials help with thermal management, long-term reliability, and stress protection.01-04-2023