Tray Mobile Modules

Results: 136
Select Image Part # Mfr. Description Datasheet Availability Pricing (INR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Supply Current Transmitting Supply Current Receiving Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Cellular, NBIoT, LTE Packaging
Telit Cinterion Mobile Modules
Non-Stocked
Min.: 30
Mult.: 1

23 dBm, 26 dBm, 29 dBm USB - 40 C + 85 C 52 mm x 30 mm x 2.25 mm Tray
Telit Cinterion Mobile Modules LE910C1-LAX 25.30.398
Non-Stocked
Min.: 180
Mult.: 1
UART, USB 3.1 VDC 3.6 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Tray
Telit Cinterion Mobile Modules LE910C1-NF SKU AT&T/VzW/TMO 25.21.264
Non-Stocked
Min.: 180
Mult.: 1
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion Mobile Modules LE910C4-EU MODULE 25.21.674
Non-Stocked
Min.: 180
Mult.: 180
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 2G, 3G Tray
Telit Cinterion Mobile Modules LE910C4-NF SKU AT&T/VzW/TMO 25.21.664
Non-Stocked
Min.: 180
Mult.: 1
200 mW I2C, SPI, UART, USB 3.4 VDC 4.2 VDC - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm 3G Tray
Telit Cinterion Mobile Modules
Non-Stocked
Min.: 100
Mult.: 1
- 40 C + 85 C Card Edge Connector Tray
Telit Cinterion LEPCIC4WX08T09AD00
Telit Cinterion Mobile Modules
Non-Stocked
Min.: 100
Mult.: 1

Tray
Telit Cinterion LEPCIC1LA08T080100
Telit Cinterion Mobile Modules
Non-Stocked
Min.: 100
Mult.: 1
- 40 C + 85 C Card Edge Connector Tray
Telit Cinterion LEPCIC4AP13T130700
Telit Cinterion Mobile Modules
Non-Stocked
Min.: 100
Mult.: 1
- 40 C + 85 C Card Edge Connector Tray
Quectel Mobile Modules Cat 4 + 3G + 2G, 16MB, Standard version, mPCIe form factor, w/sim card slot, EMEA + Southeast Asia
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100
Tray
Quectel Mobile Modules Cat 1 + 2G, 8M, w/ GNSS, w/ BT4.2, Latin America
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100

Tray
Quectel Mobile Modules Cat 1 + 2G, 8M, w/o GNSS, w/ BT4.2, Latin America
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100

Tray
Quectel Mobile Modules
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

I2C, PCM, SPI, UART, USB, USIM 3.8 V 3.8 V 29 mA - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Tray
Quectel Mobile Modules LTE Cat 1, 4M, LTE only, GNSS, No Quecopen, No VoLTE, mPCIe form factor
Non-Stocked Lead-Time 12 Weeks
Min.: 300
Mult.: 100

Tray
Quectel Mobile Modules 5G R17 Redcap, 5G SA only, LTE CAT4, M.2 FF, Global version
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100

Tray
Quectel Mobile Modules 5G Sub-6, LGA module soldered on M.2 format board (non-standard size 52x52mm)
Non-Stocked Lead-Time 12 Weeks
Min.: 60
Mult.: 60

Tray
Quectel Mobile Modules 5G Sub-6, M.2 format
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100

Tray
Quectel Mobile Modules cloud enabled, LTE Cat 4 Global (4G + 3G), 1Gb+1Gb (128MB+128MB), M.2 format
Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100
USB 2.0 3.135 V 4.4 V - 30 C + 70 C 42 mm x 30 mm x 2.3 mm LTE Cat 4 Tray
Quectel Mobile Modules CAT 4
Non-Stocked
Min.: 100
Mult.: 1

LTE Cat 4 Tray
Quectel Mobile Modules CAT 1

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, Latin A, Australia, NZ
Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, EMEA
Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1 + 3G + 2G, Cost down version of EG21-G mPCIe, Global
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Tray
Quectel Mobile Modules Cat 4 + 3G + 2G, 2Gbit ROM+2Gbit RAM, data Only, Global, mPCIe form factor
Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

Tray
Quectel Mobile Modules Cat 4 + 3G + 2G, Cost down version of EG25-G, MINIPCIE form factor, Global
Non-Stocked Lead-Time 18 Weeks
Min.: 100
Mult.: 100

Tray