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Vertical SMT Modular Jacks w/ Polyimide Film
Molex Vertical SMT Modular Jacks with Polyimide film for vacuum pick-and-place functionality can streamline high-volume PCB production and lower manufacturing costs. Automatic vacuum pick-and-place is the most common high-speed manufacturing process for precision placement of surface mount components on PCBs in mass production. The addition of Polyimide film to the surface of Molex Vertical SMT Modular Jacks facilitates automatic vacuum pick-and-place of the connector alongside other SMT components. This streamlines high-volume production and lowers manufacturing costs for customers. These Molex modular jacks are ideal for use in a variety of networking, commercial, consumer office, medical, and industrial applications.
