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TSB1 Multilayer Ceramic Devices (Band Pass Type)
TAIYO YUDEN TSB1 Multilayer Ceramic Devices (Band Pass Type) come in a compact, low-profile package, making them ideal for LTE, 5G, 5G New Radio (NR), Narrowband Internet of Things (NB-IoT), High Power User Equipment (HPUE), BLUETOOTH®, W-LAN, and Zigbee® systems. These band pass type modules offer low loss, high attenuation, and stable temperature characteristics. TAIYO YUDEN TSB1 Multilayer Ceramic Devices (Band Pass Type) are offered in three package sizes that are halogen free, RoHS and REACH compliant, and suitable for reflow soldering. The series operates in a -40°C to +85°C temperature range. Typical applications include audio/visual (AV) equipment, office automation (OA) equipment, home appliances, information and communication equipment, and more.
